2025/09/09
As electronic devices evolve toward miniaturization and higher power, heat dissipation has gradually become the core bottleneck limiting device performance—yet the thermal conductivity of heat-conducting materials has emerged as the key metric for gauging their cooling capabilities. Recently, industry technology experts pointed out that the thermal performance of these materials isn’t determined solely by a single component, but rather depends on the design of internal heat-transfer pathways and the properties of the filling medium within the material.
2025/09/09
In the industrial manufacturing sector, the temperature resistance of adhesive materials directly affects the service life and safety stability of products. Recently, breakthroughs have been made in material technology, leading to the development of high-temperature-resistant adhesives that effectively address the issue of traditional adhesives easily aging and peeling off under extreme heat conditions. These advancements now offer innovative solutions for high-temperature applications such as aerospace and automotive manufacturing.
2025/09/09
As environmental regulations become increasingly stringent and the demand for safety in electronic and electrical products continues to rise, the "halogen-free" technology for flame-retardant insulating materials has emerged as the mainstream direction in industry development. Compared to traditional halogenated flame-retardant materials, halogen-free flame-retardant insulators do not release toxic or harmful gases during combustion, while still delivering outstanding insulation performance. They are widely applicable in fields such as household appliances and rail transportation.
2025/09/09
In the fields of food and pharmaceutical packaging, desiccant and oxygen-scavenging materials can effectively inhibit microbial growth and oxidative spoilage by absorbing moisture and oxygen inside the package, thereby extending product shelf life. Recently, a significant breakthrough has been achieved in the "dual-effect-in-one" technology for these materials, enabling simultaneous enhancements in both moisture absorption capacity and oxygen-scavenging efficiency. This innovation provides a new option for packaging products that are highly susceptible to moisture or prone to oxidation.
2025/09/09
With the growing popularity of unconventional electronic devices such as wearable gadgets and flexible displays, traditional rigid thermal materials are increasingly unable to meet the cooling demands of complex structures. However, innovative "flexibilization" technologies for thermal materials have effectively addressed this challenge. Flexible thermal materials can bend and fold according to the shape of the device, ensuring close contact with heat-generating components and enabling highly efficient heat transfer.
2025/09/09
In automated production lines, the curing speed of adhesive materials directly affects the production cycle time, while the application of "rapid curing" technology has significantly boosted manufacturing efficiency, marking a major technological breakthrough in the field of adhesives. Rapid-curing adhesives can achieve complete solidification within just seconds to minutes, eliminating the need for prolonged baking processes, making them ideal for automated assembly scenarios involving automotive parts, electronic components, and more.
2025/09/09
The trend toward miniaturization of electronic devices has placed higher demands on the thickness of flame-retardant insulating materials. "Thin-film" technology not only reduces material usage but also creates more design flexibility for internal device structures, making it a key area of development in the field of flame-retardant insulation materials.
2025/09/09
With the advancement of smart packaging technology, the "smartification" and upgrade of desiccant and oxygen-scavenging materials have become a new research hotspot. By integrating these materials with sensing technologies, it’s now possible to monitor environmental parameters inside the package—such as humidity and oxygen concentration—in real time, while providing users with visual feedback. This innovative approach offers a cutting-edge technological solution for enhancing product quality control.
2025/09/09
In electronic device cooling systems, the interfacial thermal resistance between the thermally conductive material and the heat-generating or heat-dissipating components is a key factor affecting cooling efficiency. Recently, "interface optimization" technology for thermally conductive materials has made significant progress. By enhancing the surface properties of the materials and optimizing the interface contact method, this technology effectively reduces interfacial thermal resistance, significantly improving overall heat dissipation performance.
2025/09/09
Against the backdrop of the "Dual Carbon" goals, research and development of "eco-friendly" technologies for adhesive materials have become a key industry focus. Eco-friendly adhesives not only require raw materials that are non-toxic and harmless, but also demand reduced energy consumption and lower pollutant emissions during the manufacturing process. Additionally, these materials should be biodegradable or recyclable, helping to drive the manufacturing sector toward greener, more sustainable practices.
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