Language

As electronic devices evolve toward miniaturization and higher power, heat dissipation has gradually become the core bottleneck limiting device performance—yet the thermal conductivity of heat-conducting materials remains the key metric for gauging their cooling capabilities. Recently, industry technology experts pointed out that the thermal performance of these materials is not determined solely by a single component, but rather depends on the design of internal heat-transfer pathways and the properties of the filling medium within the material itself.
From a technical perspective, thermal conductive materials primarily rely on thermal conductive fillers such as metal oxides and carbon fibers to build a heat-conduction network. The particle size distribution, filler content, and compatibility with the matrix material of these fillers directly influence the thermal conductivity coefficient. For instance, if the filler content is too low, it becomes difficult to establish effective heat-conduction pathways, leading to a significant drop in thermal efficiency. Conversely, excessively high filler levels may compromise the material's flexibility, making it unsuitable for complex device structures. Currently, mainstream high-performance thermal conductive materials in the industry have achieved thermal conductivity coefficients exceeding 50 W/(m·K), effectively addressing the cooling demands in high-temperature environments—such as power modules in new-energy vehicles and chips used in 5G base stations. Experts emphasize that when selecting thermal conductive materials, it’s crucial to consider factors like the operating temperature and structural dimensions of the equipment, rather than simply prioritizing high thermal conductivity at the expense of the material’s practical suitability.