Language

The trend toward miniaturization of electronic devices has placed higher demands on the thickness of flame-retardant insulating materials. "Thin-film" technology not only reduces material usage but also creates more design flexibility for internal device structures, making it a key area of development in the field of flame-retardant insulation materials.
Industry experts say the key challenge in developing thin, flame-retardant insulation materials lies in maintaining excellent flame-retardant and insulating properties while reducing their thickness. Currently, by leveraging ultra-thin substrates—such as polyimide films just 5 μm thick—and advanced ultra-thin coating technologies, including nanoscale flame-retardant coatings, manufacturers have successfully achieved mass production of flame-retardant insulation materials thinner than 20 μm. These materials meet the UL94 V-0 flame-retardant rating and exhibit a dielectric strength exceeding 15 kV/mm, making them widely used for internal insulation and flame protection in compact electronic devices like smartphones and laptops. Moreover, these thin, flame-retardant insulation materials offer significant weight advantages, helping to reduce the overall device weight—a crucial factor aligning with the growing demand for portable electronic gadgets.