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We offer one-stop material solutions ranging from thermal conductivity and adhesion to flame retardancy. In response to the industry trend toward high performance and ultra-thin devices, we provide a comprehensive line of thermal management products—including silicone sheets, gels, thermal greases, and phase-change materials with high thermal conductivity—effectively filling interface gaps and reducing thermal resistance. Additionally, our ultra-thin, high-performance graphene films and artificial graphite sheets help achieve rapid, uniform heat distribution across surfaces. Meanwhile, our complementary adhesive materials not only ensure structural fixation and sealing but also boast exceptional thermal or electrical conductivity, meeting diverse design requirements. We are committed to helping our customers optimize their thermal management systems and enhance product performance and reliability through innovative material combinations and in-depth application support, working together to meet future challenges.

Semiconductor

As a core materials partner for semiconductor packaging and thermal management solutions, we specialize in providing reliable thermal management support for high-performance chips. Our highly reliable TIM1 material—chip-level thermal interface material—is specifically designed for advanced packaging. It features extremely low thermal resistance and outstanding aging resistance, making it a critical component for ensuring precise control of chip junction temperatures. At the same time, we offer complementary chip bonding materials, thermally conductive gels, as well as flame-retardant epoxy resins and potting compounds that meet stringent UL standards, addressing thermal management, bonding, packaging, and protection needs across the entire spectrum—from individual chips to PCB board-level applications. We are committed to leveraging innovative materials science and deep application expertise to help our customers improve product yield, optimize thermal performance, and ensure long-term reliability, thereby meeting the increasingly demanding thermal challenges and the trend toward miniaturization.

Artificial intelligence

As a key partner in thermal management and reliability for AI hardware, we specialize in providing high-performance material solutions for AI chips, servers, and various computing devices. Faced with the astonishing computational density and sustained high thermal loads of AI chips, our high-thermal-conductivity interface materials—such as ultra-low thermal-resistance silicon greases, phase-change materials, and gels—efficiently dissipate core heat, ensuring continuous and stable performance. Our complementary advanced bonding materials not only deliver robust structural integrity and electromagnetic shielding but also exhibit exceptional thermal or electrical conductivity, making them well-suited for complex integrated designs. All materials in our product line meet the highest-level flame-retardant safety standards, safeguarding the long-term stable operation of high-power-density AI clusters and in-vehicle computing platforms. Leveraging innovative material technologies and deep collaborative partnerships, we help our customers overcome thermal bottlenecks and ensure the performance and longevity of AI hardware even under extreme operating conditions.

Energy storage

As the core enabler of safe and long-lasting operation for energy storage batteries, we specialize in providing efficient and reliable thermal management and safety material solutions—from individual cells and modules to complete battery packs. In response to the stringent requirements of energy storage systems regarding thermal uniformity, electrical insulation, and absolute flame retardancy, we offer high-performance thermally conductive interface materials that ensure even heat distribution among cells and efficient heat dissipation, thereby slowing down cell degradation. Our complementary structural adhesives and sealing materials not only facilitate robust integration but also exhibit outstanding aging resistance and thermal conductivity. Addressing the critical challenges of explosion prevention and thermal insulation, our flame-retardant ceramicizing tapes transform into a solid protective layer at high temperatures, providing an effective fire barrier between cells and at key components and helping systems meet rigorous safety standards. We are committed to leveraging innovative material combinations to lay a solid foundation for thermal safety control and full-lifecycle reliability in energy storage systems.

New energy vehicles

As a trusted partner in thermal management and high-voltage safety for new-energy vehicles, we address the severe thermal challenges and stringent safety regulations posed by the high power density of electric vehicles. Our highly reliable thermally conductive materials—such as gels and silicone sheets—are widely used in battery cells, modules, IGBTs, and OBCs, ensuring efficient heat dissipation and uniform temperature distribution. Our complementary structural adhesives and potting compounds not only provide robust, long-lasting fixation and sealing for battery packs and motors but also deliver exceptional thermal conductivity, insulation, and vibration resistance. Specifically designed to safeguard against thermal runaway—a critical concern within battery packs—our flame-retardant ceramicizing tapes can form a strong thermal and electrical insulation barrier under extreme high-temperature conditions, effectively preventing the spread of heat and helping battery systems meet even the most rigorous safety standards. We are committed to leveraging innovative material technologies to provide solid support for the range, performance, and intrinsic safety of new-energy vehicles.

Communication

As a key enabler of high reliability in communication equipment, we specialize in providing professional thermal management and protection solutions for 5G base stations, data centers, and optical transmission equipment. We offer highly efficient thermal interface materials—such as high-thermal-conductivity gels and phase-change sheets—that are applied to AAU/RRU chips, optical modules, and server CPUs, ensuring rapid heat dissipation from critical components and maintaining signal stability and consistent performance. Our complementary structural adhesives and sealing materials not only facilitate robust assembly and protection of equipment but also boast exceptional thermal conductivity, electrical insulation, and electromagnetic compatibility properties. To enhance fire safety within equipment, our flame-retardant ceramicizing tapes can form a strong, insulating barrier under abnormal high-temperature conditions, effectively elevating the fire-resistance rating of critical components and providing solid security assurance for the long-term reliable operation of communication infrastructure.

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E-Mail

info@gddingtai.com

8615382878626

Dingtai New Materials

China: Building 3, Huashen Wisdom Port, Hongmei Town, Dongguan City, Guangdong Province

Vietnam: Phase I, Plot VI.3, Thuan Thanh 3rd Industrial Park, Bac Ninh Province

Phone: +86 0769-85077867

Email: info@gddingtai.com

Product Categories

Thermal Conductive Materials

Flame Retardant Materials

Potting Compounds

Adhesive Materials

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