Thermal Conductive Materials-Product Showcase-Dingtai - Specialized in Thermal Conductive New Material R&D

This thermal conductive interface material is produced through a specialized process, utilizing silicone resin as the matrix and filled with thermally conductive fillers. Compared to other thermal interface materials (TIMs), it offers higher thermal conductivity and improved mechanical strength. The product features single-sided adhesive backing for easy handling and application. It is suitable for covering uneven or irregular device surfaces, effectively filling the gap between heat-generating components and heat sinks to achieve optimal heat dissipation. We deliver tailored packaging and labeling.

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6W PI Film Backing Thermal Conductive Pad

This thermal conductive interface material is produced through a specialized process, utilizing silicone resin as the matrix and filled with thermally conductive fillers. Compared to other thermal interface materials (TIMs), it offers higher thermal conductivity and improved mechanical strength. The product features single-sided adhesive backing for easy handling and application. It is suitable for covering uneven or irregular device surfaces, effectively filling the gap between heat-generating components and heat sinks to achieve optimal heat dissipation. We deliver tailored packaging and labeling.

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4.5 W Thermal Conductive Phase Change Material ( Customizable)

DTM8822 Thermal Phase Change Pad is a thermally conductive phase change material, formulated with special silicone resin as the matrix, incorporated with phase change paraffin powder and metal oxides, and manufactured via a specialized production process. Upon reaching the phase change temperature, the material softens and demonstrates exceptional wettability, which effectively enhances the heat transfer efficiency between heat-generating components and heat-dissipating surfaces.

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5W Fiberglass Thermal Conductive Pad Single-sided adhesive backing

This thermal conductive interface material is produced through a specialized process, utilizing silicone resin as the matrix and filled with thermally conductive fillers. Compared to other thermal interface materials (TIMs), it offers higher thermal conductivity and improved mechanical strength. The product features single-sided adhesive backing for easy handling and application. It is suitable for covering uneven or irregular device surfaces, effectively filling the gap between heat-generating components and heat sinks to achieve optimal heat dissipation. We deliver tailored packaging and labeling.

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3W Thermal Grease/Thermal Paste (Customizable)

DTH0351 is a paste-type thermal interface material designed for use between high-power electronic components and heat sinks. Its excellent wettability enables it to rapidly fill micro-pores on the contact interface, significantly reducing interfacial thermal resistance.It can quickly and effectively lower the temperature of electronic components, thereby extending their service life and improving operational reliability. In addition to high thermal conductivity, the product exerts no stress during application and maintains high stability within the temperature range of -40℃ to 125℃, fully complying with the requirements of the electronics industry for paste-type thermal interface materials.

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6W One-Component Thermal Gel (customizable)

DTC6513 Thermal Conductive Gel is silicone-based, filled with various high-performance thermal conductive fillers. It features high thermal conductivity, low thermal resistance, excellent electrical insulation, and superior compressibility. Designed to cover uneven or irregular device/component/shell surfaces, it fully fills the gaps between heat-generating chips and heat sinks, enabling rapid heat dissipation.

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3.5W One-Component Thermal Gel (customizable)

DTC0351 Thermal Conductive Gel is silicone-based, filled with various high-performance thermal conductive fillers. It features high thermal conductivity, low thermal resistance, excellent electrical insulation, and superior compressibility. Designed to cover uneven or irregular device/component/shell surfaces, it fully fills the gaps between heat-generating chips and heat sinks, enabling rapid heat dissipation.

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3W Silicon Thermal Conductive Pad Single-sided adhesive backing

This thermal conductive interface material is produced through a specialized process, utilizing silicone resin as the matrix and filled with thermally conductive fillers. Compared to other thermal interface materials (TIMs), it offers higher thermal conductivity and improved mechanical strength. The product features single-sided adhesive backing for easy handling and application. It is suitable for covering uneven or irregular device surfaces, effectively filling the gap between heat-generating components and heat sinks to achieve optimal heat dissipation. We deliver tailored packaging and labeling.

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1.5–12W Thermal Conductive Pad (Customizable)

This product is manufactured via advanced processes, with a silicone resin matrix loaded with thermally conductive fillers. It boasts high thermal conductivity, excellent mechanical strength, and ease of application, making it a best-selling thermal interface material on the market. Compared to other thermal interface materials, this product is better able to adapt to uneven or irregular device surfaces, enabling it to fully fill the gap between heat-generating components and heat sinks, thereby achieving high-performance heat dissipation. Customized solutions are available to meet specific customer needs and adapt to diverse application scenarios. Whether in the electronics, computer, or automotive industries, this product consistently delivers outstanding performance, ensuring stable equipment operation and extending equipment service life. We deliver tailored packaging and labeling.

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3.5W Thermal Grease/Thermal Paste (Customizable)

DTH3322 is a paste-type thermal interface material engineered for application between high-power electronic components and heat sinks. Its excellent wettability allows it to rapidly fill micro-pores on the contact interface, significantly reducing interfacial thermal resistance. This material can quickly and effectively lower the temperature of electronic components, thereby extending their service life and improving operational reliability. In addition to high thermal conductivity, it exerts no stress during application and maintains high stability within the temperature range of -40℃ to 125℃, fully complying with the requirements of the electronics industry for paste-type thermal interface materials.

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One-Component Thermal Gel (customizable)

Thermal conductive gel is formulated with silicone as the matrix and loaded with various high-performance thermally conductive powders. It features high thermal conductivity, low thermal resistance, excellent electrical insulation, and facilitates rework. It is ideal for covering uneven or irregularly shaped heat-generating components and housing surfaces, effectively filling the gaps between heat-generating chips and heat sinks to deliver rapid heat dissipation. We deliver tailored packaging and labeling.

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Two-Component Thermal Conductive Gel (customizable)

Two-component thermally conductive interface material—this product boasts excellent structural compatibility, outstanding electrical insulation and voltage resistance, as well as reliable thermal stability and consistent performance in operation. Before curing, it exhibits gel-like fluidity; after curing, it displays properties equivalent to those of thermally conductive gaskets. We deliver tailored packaging and labeling.

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