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2025/09/09

The technical logic behind the thermal conductivity of heat-conducting materials—and why it has become critical for cooling electronic devices

As electronic devices evolve toward miniaturization and higher power, heat dissipation has gradually become the core bottleneck limiting device performance—yet the thermal conductivity of heat-conducting materials has emerged as the key metric for gauging their cooling capabilities. Recently, industry technology experts pointed out that the thermal performance of these materials isn’t determined solely by a single component, but rather depends on the design of internal heat-transfer pathways and the properties of the filling medium within the material.

2025/09/09

"Temperature-Resistant" Technology Upgraded for Bonding Materials—Solving Adhesion Challenges in High-Temperature Industrial Applications

In the industrial manufacturing sector, the temperature resistance of adhesive materials directly affects the service life and safety stability of products. Recently, breakthroughs have been made in material technology, leading to the development of high-temperature-resistant adhesives that effectively address the issue of traditional adhesives easily aging and peeling off under extreme heat conditions. These advancements now offer innovative solutions for high-temperature applications such as aerospace and automotive manufacturing.

2025/09/09

Flame-retardant insulation materials are trending toward "halogen-free" technology, balancing safety with environmental protection.

As environmental regulations become increasingly stringent and the demand for safety in electronic and electrical products continues to rise, the "halogen-free" technology for flame-retardant insulating materials has emerged as the mainstream direction in industry development. Compared to traditional halogenated flame-retardant materials, halogen-free flame-retardant insulators do not release toxic or harmful gases during combustion, while still delivering outstanding insulation performance. They are widely applicable in fields such as household appliances and rail transportation.

2025/09/09

A breakthrough "dual-effect" technology in dry deoxygenation materials extends the shelf life of food and pharmaceutical products.

In the fields of food and pharmaceutical packaging, desiccant and oxygen-scavenging materials can effectively inhibit microbial growth and oxidative spoilage by absorbing moisture and oxygen inside the package, thereby extending product shelf life. Recently, a significant breakthrough has been achieved in the "dual-effect-in-one" technology for these materials, enabling simultaneous enhancements in both moisture absorption capacity and oxygen-scavenging efficiency. This innovation provides a new option for packaging products that are highly susceptible to moisture or prone to oxidation.

2025/09/09

Innovative "flexibilization" technology for thermal materials, tailored to meet the cooling needs of uniquely shaped electronic devices.

With the growing popularity of unconventional electronic devices such as wearable gadgets and flexible displays, traditional rigid thermal materials are increasingly unable to meet the cooling demands of complex structures. However, innovative "flexibilization" technologies for thermal materials have effectively addressed this challenge. Flexible thermal materials can bend and fold according to the shape of the device, ensuring close contact with heat-generating components and enabling highly efficient heat transfer.