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In electronic device cooling systems, the interfacial thermal resistance between thermally conductive materials and both the heat-generating and heat-dissipating components is a critical factor affecting cooling efficiency. Recently, "interface optimization" technology for thermally conductive materials has made significant progress—by enhancing material surface properties and refining interface contact methods, this approach effectively reduces interfacial thermal resistance, dramatically improving overall heat dissipation performance.
Technical experts explain that the interfacial thermal resistance primarily stems from the microscopic irregularities on material surfaces and the presence of air gaps. Interface optimization techniques address this issue mainly through two approaches: First, by applying microstructural treatments (such as nanoscale bump designs) to the surface of thermally conductive materials, which increases the contact area with the mating surface and minimizes air gaps. Second, by coating the surface of these materials with an interface modifier that reduces surface tension, thereby enhancing the wettability at the interface. Experimental data shows that after interface optimization, the thermal resistance at the interface can be reduced by more than 40%. In CPU cooling module applications, this leads to a drop in CPU temperature by 6–10°C. Moreover, interface optimization technology also improves the weather resistance of thermally conductive materials, helping to mitigate the degradation of thermal performance caused by interfacial aging over time—and ultimately extending the service life of the entire cooling system.