Innovative "flexibilization" technology for thermal materials, tailored to meet the cooling needs of uniquely shaped electronic devices.

With the growing popularity of unconventional electronic devices such as wearable gadgets and flexible displays, traditional rigid thermal materials are increasingly unable to meet the cooling demands of complex structures. However, innovative "flexibilization" technologies for thermal materials have effectively addressed this challenge. Flexible thermal materials can bend and fold according to the shape of the device, ensuring close contact with heat-generating components and enabling highly efficient heat transfer.

2025-09-09

With the growing popularity of unconventional electronic devices such as wearable gadgets and flexible displays, traditional rigid thermal materials are increasingly unable to meet the cooling demands of complex structures. However, innovative "flexibilization" technologies for thermal materials have effectively addressed this challenge. Flexible thermal materials can bend and fold according to the shape of the device, ensuring close contact with heat-generating components and enabling highly efficient heat transfer.
Technical experts point out that the key to flexible thermal materials lies in the selection of the matrix material and the dispersion process of the thermally conductive fillers. Currently, mainstream flexible thermal materials use silicone or rubber as the matrix, with graphene, copper powder, and other thermally conductive fillers added. Through specialized dispersion techniques, these fillers are evenly distributed throughout the matrix, creating continuous heat-conduction pathways. For instance, the thickness of flexible thermal pads can be precisely controlled between 0.1 and 5 mm, while their tensile strength exceeds 5 MPa. These materials maintain stable thermal performance across a temperature range of -40°C to 200°C. In devices such as smartwatches and foldable phones, flexible thermal materials can closely adhere to irregularly shaped heat-generating components like batteries and chips, effectively reducing local temperatures by 5 to 8°C—significantly enhancing both the user experience and the lifespan of the device.

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