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0.8W Thermal Conductive Silicone Adhesive (Customizable)

DTP1315 is a silicone-based thermal interface material, formulated with silicone resin as the matrix, filled with ceramic powder and metal oxides, and manufactured through a specialized process. It is a one-component white paste with strong adhesion, waterproof and sealing properties, and excellent mechanical strength, exhibiting good bonding performance to most metallic and non-metallic materials.

2W TIM1 Thermal Silicone Adhesive (Customizable)

DTP2522 is a one-component semi-flowable TIM1 thermal interface material (TIM), formulated with silicone resin as the matrix, filled with ceramic powder and metal oxides, and manufactured through a specialized process.This thermal interface material achieves rapid curing when heated to 150℃, with the bonding effect improving as the heating time extends. Compared with other thermal interface materials, it offers excellent applicability, superior surface compatibility, reliable electrical insulation, and strong adhesion.

8W Fiberglass Thermal Conductive Pad

This thermal conductive interface material is produced through a specialized process, utilizing silicone resin as the matrix and filled with thermally conductive fillers. Compared to other thermal interface materials (TIMs), it offers higher thermal conductivity and improved mechanical strength. The product features single-sided adhesive backing for easy handling and application. It is suitable for covering uneven or irregular device surfaces, effectively filling the gap between heat-generating components and heat sinks to achieve optimal heat dissipation. We deliver tailored packaging and labeling.

6W PI Film Backing Thermal Conductive Pad

This thermal conductive interface material is produced through a specialized process, utilizing silicone resin as the matrix and filled with thermally conductive fillers. Compared to other thermal interface materials (TIMs), it offers higher thermal conductivity and improved mechanical strength. The product features single-sided adhesive backing for easy handling and application. It is suitable for covering uneven or irregular device surfaces, effectively filling the gap between heat-generating components and heat sinks to achieve optimal heat dissipation. We deliver tailored packaging and labeling.