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Silicone potting compounds, with their outstanding electrical insulation properties, resistance to high and low temperatures, chemical stability, and buffering protection capabilities, have become indispensable materials in modern electronics and high-end manufacturing. Silicone potting compounds are formulated with silicone polymers as the matrix and incorporating fillers, crosslinking agents, catalysts, and other additives. They cure at room temperature or under heat-assisted conditions, forming a three-dimensional structure that exhibits excellent electrical insulation,resistance to high and low temperatures, weather resistance, chemical stability, and elasticity, thereby providing robust protection for internal components. Two-component silicone potting compounds typically require mixing of components A and B in a specific ratio before curing. Based on their curing mechanisms, they can be classified into addition-type (which produce no by-products and have low shrinkage during curing) and condensation-type (which may generate small amounts of by-products such as alcohols or acids).

• 1:1 ratio; can be cured at room temperature or with heating.
• Excellent fluidity, electrical insulation, and thermal shock resistance.
• Moderate hardness, easy to dispense.

• When using, first stir components A and B separately until thoroughly mixed. Then, weigh out components A and B according to the specified ratio, mix them evenly in a clean container, and proceed with potting after eliminating air bubbles completely under vacuum.
• This product is susceptible to impaired curing effects when contaminated by organic compounds containing P (phosphorus), S (sulfur), and N (nitrogen). During use, take care to avoid contamination to prevent incomplete curing.

• Storage conditions: Temperature 5~35℃; Humidity 0~75%
• Shelf life: 6 months
• Packaging specifications: 1 kg/can or 20 kg/drum

• Temperature Resistance: Clearly specify the high and low temperature ranges within which the device will operate, as well as whether there is a requirement for thermal cycling. Silicone potting compounds typically have a wide temperature resistance range (e.g., from -40℃ to over +200℃). 
• Thermal Conductivity: For high-power components that generate significant heat—such as IGBTs (insulated-gate bipolar transistors), high-power LEDs, and power modules—it is essential to select potting compounds with high thermal conductivity to efficiently dissipate heat and prevent overheating. 
• Fluidity: When components have complex structures and narrow gaps, a glue with high fluidity is required to ensure thorough filling and impregnation. Conversely, if there are vertical components or if flow-down needs to be avoided, a product with excellent thixotropy and resistance to sagging would be more appropriate. 
• Electrical Insulation: In the vast majority of applications, potting compounds are required to exhibit excellent electrical insulation properties (high volume resistivity and high dielectric strength) to ensure insulation between components and prevent short circuits. 
• Hardness and Stress: Low-hardness, highly elastic colloids (such as silicone gels) can better absorb stress, making them suitable for fragile components (such as chip bonding wires) and products operating in environments with large temperature fluctuations and vibration. High-hardness colloids exhibit greater mechanical strength but may generate higher internal stresses. 
• Adhesion: Whether good adhesion to specific materials (such as metals, plastics, and ceramics) is required. Note that addition-curing silicone potting compounds may require a primer to enhance adhesion to certain materials. 
• Flame Retardancy: In fields with extremely high requirements, such as new-energy vehicles, aerospace, and high-end power supplies, encapsulating adhesives typically need to meet high flame-retardant ratings (e.g., UL94 V-0). 

• Curing methods: Single-component systems (typically moisture-cured) and two-component systems (which require mixing before curing). Addition-cure two-component adhesives generally cure deeply with no byproducts and exhibit low shrinkage. Condensation-cure two-component or single-component adhesives may cure starting from the surface; when performing deep potting, it’s important to monitor the curing progress carefully.
•  Pot Life/Curing Time: The work time (pot life) determines how long the mixed adhesive remains usable for application, and it must be aligned with your production rhythm. The curing time affects production efficiency. 
• Mixing ratio: For two-component adhesives, pay close attention to the mixing ratio (usually by weight rather than by volume). Accurate weighing and thorough mixing are critical for complete curing. 

• Overall cost: In addition to the unit price, factors such as glue density (which affects the amount used per encapsulation), production efficiency (curing speed), defect rate, and repair difficulty must also be taken into account. 
• Appearance and Transparency: If you need to observe the operational status of encapsulated components or perform optical inspections, you should choose a potting compound with high transparency. Dark-colored compounds (such as black) can be used to shield circuits or provide UV resistance. 
• Repairability: Silicone potting compounds—especially gels—are typically easy to cut open and replace internal faulty components due to their elasticity, enabling subsequent re-potting. This is particularly important for high-value products. 
• Environmental Protection and Certification: Pay attention to compliance with environmental directives such as RoHS and REACH. In the automotive electronics sector, certifications like AEC-Q200 may be required; for medical devices, biocompatibility needs to be considered. 

• Surface Cleaning: Before potting, ensure that the components to be potted are dry and clean, free of dust, oil, and moisture, to avoid compromising the potting effect and the performance of the encapsulant. 
• Thorough Stirring: Especially for two-component products, stir components A and B separately before use. After mixing, be sure to stir thoroughly and evenly; otherwise, incomplete curing may occur.