Language

Video

Video

• High thermal conductivity
• High compression ratio, low volatility
• Excellent electrical insulation performance
• Multiple thickness options for a broad application scope.

• Before installation, clean the surface of the component to be mounted thoroughly, ensuring it is free of obvious dust, debris, and other contaminants, so as not to compromise the overall thermal conductivity and heat dissipation performance after installation.
• During installation, for products that have already been die-cut and feature low hardness with strong self-adhesion, if conditions permit, you should first remove the protective film,attach it to the component, and then remove the second protective film. For products that have already been die-cut and feature high hardness with weak self-adhesiveness, you can first remove the protective film, bend the pad until its edges curl up, and then use flat-nose tweezers to pick it up and adhere it.
• After installation, if you notice bubbles or unevenness, use clean tools to carefully remove the gasket and re-install it. This will help ensure that the overall thermal conductivity and heat dissipation performance is not compromised after installation.

• Storage environment: Temperature 5–35℃, humidity 0–65%.
• Shelf life: 12 months;
• Transportation: This product is environmentally friendly and healthy, and should be transported as non-hazardous goods.

1. Thermal conductivity  

• This is the core metric for evaluating a material's thermal conductivity, with units of W/m·K. The higher the value, the better the thermal conductivity performance. However, this doesn't mean blindly pursuing higher values—rather, it’s important to consider cost and application scenarios comprehensively.
• For low-power devices such as standard consumer electronics chips, 1.0 to 3.0 W/m·K is usually sufficient.
• For medium- and high-power devices (such as CPUs, GPUs, and power modules): 3.0 to 8.0 W/m·K is a common choice.
• For applications requiring extremely high power or seeking high-performance thermal management—such as certain servers and high-power IGBTs—products with thermal conductivity exceeding 8.0 W/m·K may be necessary; however, this will significantly increase costs.

2. Thickness

• Thickness selection is crucial and should be determined by the actual gap distance between the heat source and the heat sink.
• The basic principle is that the thickness of the thermal pad should be equal to or slightly greater than (and it’s generally recommended to compress it by 20%–50% to match the gap thickness) the gap itself. This ensures that under installation pressure, the pad can be fully compressed and completely fill the gap without generating excessive stress.
• The thinner the gasket, the lower the thermal resistance typically is; however, if it’s too thin, it may fail to adequately fill the gap. If it’s too thick, it will increase thermal resistance and could potentially damage components due to excessive compression.

3. Hardness and Compressibility

• Hardness is typically expressed in Shore hardness units (Shore OO or Shore A). The lower the hardness, the softer the material, and the easier it is to compress under low pressure and to fill irregular surfaces, thereby reducing thermal contact resistance and making it suitable for precision or low-stress applications. However, lower hardness is not always better; it’s important to also consider tear strength to prevent damage during installation. High-hardness gaskets offer greater mechanical strength, but they may require higher compression pressures to achieve effective gap filling.

4. Electrical Performance

• For applications requiring insulation, it is essential to pay attention to the dielectric strength (in units of kV/mm) and volume resistivity. Ensure that these values are significantly higher than the operating voltage of the device, leaving ample margin. There are also a few specially designed conductive thermal pads intended for applications that require both thermal conductivity and electrical conduction; however, in the vast majority of application scenarios, high insulation performance is required.

5. Long-term reliability ​

• Operating temperature range: Ensure that the gasket can withstand the high and low temperature ranges of the equipment’s operation, as well as any potential thermal cycling.
• Compression set resistance refers to a material’s ability to rebound and restore its original thickness after being subjected to prolonged compression. The lower this value, the better—indicating superior resistance to aging and fatigue, enabling the material to maintain effective contact over the long term and preventing excessive deformation that could lead to gaps and increased thermal resistance.
• Oil bleed rate: For silicone gaskets, this is an important indicator. A low oil-extraction rate means lower risk of contamination and more stable long-term performance.

6. Other factors ​  

• Flame Retardancy: In fields such as automotive, aerospace, and high-end power supplies, gaskets typically need to meet high flame-retardant ratings like UL94 V-0.
• Certification: Depending on industry requirements, compliance with specific standards or certifications such as RoHS, REACH, UL, and ASTM may be necessary.

7. Operation Tips and Precautions

• Surface Cleaning: Before installation, ensure that the heating element and the radiator surface are clean, dry, and smooth, free of oil, grease, and dust, to achieve low thermal contact resistance.
• Apply appropriate pressure: During installation, a certain amount of pressure must be applied to ensure that the gasket is moderately compressed—typically between 20% and 50%—to achieve optimal sealing performance. However, the pressure should not be excessive, as this could damage the components or the gasket itself.