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Product Applications

Product Features

• Thermal Conductivity: 2.0 W/m·K
• Semi-fluid with good surface wettability;
• High hardness, high insulation, low thermal resistance;
• Suitable for a variety of processes, including dispensing and coating.

Technical Parameters

Process usage

• Storage environment: Temperature 0–5℃;
• Shelf life: 6 months;
• Packaging specification: 30 cc per unit (customizable).

Key factors for selecting TIM1 adhesive

Choosing the right TIM1 requires a comprehensive consideration of several factors, much like answering a multiple-choice question:

Thermal Conductivity and Thermal Resistance Performance

Thermal conductivity is a fundamental metric, but it’s not the only one. It’s important to pay attention to the effective thermal conductivity of the material under the actual pressure and temperature conditions of its application.

Thermal contact resistance is even more critical. It depends on whether the material can effectively fill the microscopically rough interfaces, thereby reducing the thermal resistance at the solid-solid contact. The wettability, compressibility, and phase-change characteristics of the material have a decisive impact on this aspect.

Long-term reliability

Thermal Stability and Temperature Resistance: Performance must remain stable and not degrade under chip junction temperatures (typically >100°C) and reflow soldering temperatures (~260°C).

Anti-aging and anti-drying: Prevent materials from oiling, powdering, or cracking due to prolonged operation at high temperatures, which could lead to a sharp increase in thermal resistance.

Thermal Cycling and Mechanical Shock: Frequent switching of the chip causes temperature cycling, and the material must withstand the resulting thermal stresses to prevent delamination or cracking.

Process-structure compatibility

Interface Filling Capability: The material used must match the thickness and flatness of the gap between the chip and the heat sink cover. If the gap is large or uneven, materials with high compliance—such as gels or phase-change sheets—should be selected.

Process Compatibility: Compatible with chip packaging processes (such as curing temperature, time, and pressure) as well as subsequent SMT reflow soldering processes. For example, silver sintering requires specialized sintering equipment and process control.

Stress Matching: The thermal expansion coefficients of the materials should be as closely matched as possible to those of the chip and substrate, in order to minimize thermomechanical stress and prevent chip warping or damage.

Electrical and Safety Characteristics

Electrical Insulation: Most applications require high insulation to prevent short circuits.

Ion purity: High purity is essential to prevent migration and corrosion, which could compromise chip reliability.

Precautions

Systematic evaluation, rather than relying solely on parameters: The laboratory’s “ultra-high thermal conductivity” may be significantly compromised in actual packaging interfaces due to poor contact. It is essential to conduct system-level thermal resistance testing that takes into account both the interface structure and the manufacturing process.

Reliability testing is indispensable: rigorous reliability verification—including thermal cycling, high-temperature and high-humidity tests, and high-temperature storage—must be conducted to simulate the chip’s entire lifecycle.

Comprehensive Cost Analysis: Consider the total cost of ownership, including material costs, investment in process equipment, yield rate impacts, and potential maintenance costs. For example, although silver sintering materials are expensive, their superior reliability may result in lower overall costs in high-end applications.

Supply Chain and Technical Support: Ensure that suppliers have stable quality consistency, technical support capabilities, and joint development expertise to handle design changes.

In summary, selecting TIM1 adhesive is a systems engineering decision. The core principle is to find the optimal balance among thermal performance, process feasibility, and total cost, all while meeting the ultimate reliability targets. It is recommended to work closely with material suppliers, get involved early in the design phase, and conduct thorough sample testing and reliability validation.

The TIM1 adhesive is an “critical bottleneck” encapsulated within the chip itself. Its key features revolve around three core objectives: ultra-high thermal conductivity, reliable stability, and process compatibility.

First, its fundamental mission is to achieve ultra-high thermal conductivity. By featuring a high thermal conductivity coefficient and low contact thermal resistance, it efficiently dissipates the intense heat generated by the chip’s core, directly determining whether the chip can operate at full performance. Second, it must exhibit exceptional long-term reliability and stability. It must withstand the high temperatures encountered during chip operation, the elevated temperatures of solder reflow in packaging, and prolonged thermal cycling without any degradation in performance or cracking—this is the cornerstone for ensuring the chip’s stable operation over its entire lifespan. Third, its critical mechanical and electrical properties—such as specific hardness, rapid curing, excellent electrical insulation, and a thermal expansion coefficient that matches that of silicon chips—guarantee compatibility with packaging processes and effectively relieve thermal stresses, thereby safeguarding the chip’s integrity. Finally, perfect compatibility with mass-production processes is a prerequisite for its widespread adoption; it must seamlessly integrate with existing packaging and surface-mount technologies.

Therefore, the core value of TIM1 adhesive lies in striking the optimal balance between extreme thermal management requirements, stringent reliability demands, and large-scale mass-production processes—making it a critical foundational material that underpins both chip performance and longevity.

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