Thermal conductive pad

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8W Fiberglass Thermal Conductive Pad

This thermal conductive interface material is produced through a specialized process, utilizing silicone resin as the matrix and filled with thermally conductive fillers. Compared to other thermal interface materials (TIMs), it offers higher thermal conductivity and improved mechanical strength. The product features single-sided adhesive backing for easy handling and application. It is suitable for covering uneven or irregular device surfaces, effectively filling the gap between heat-generating components and heat sinks to achieve optimal heat dissipation. We deliver tailored packaging and labeling.

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6W PI Film Backing Thermal Conductive Pad

This thermal conductive interface material is produced through a specialized process, utilizing silicone resin as the matrix and filled with thermally conductive fillers. Compared to other thermal interface materials (TIMs), it offers higher thermal conductivity and improved mechanical strength. The product features single-sided adhesive backing for easy handling and application. It is suitable for covering uneven or irregular device surfaces, effectively filling the gap between heat-generating components and heat sinks to achieve optimal heat dissipation. We deliver tailored packaging and labeling.

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5W Fiberglass Thermal Conductive Pad Single-sided adhesive backing

This thermal conductive interface material is produced through a specialized process, utilizing silicone resin as the matrix and filled with thermally conductive fillers. Compared to other thermal interface materials (TIMs), it offers higher thermal conductivity and improved mechanical strength. The product features single-sided adhesive backing for easy handling and application. It is suitable for covering uneven or irregular device surfaces, effectively filling the gap between heat-generating components and heat sinks to achieve optimal heat dissipation. We deliver tailored packaging and labeling.

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3W Silicon Thermal Conductive Pad Single-sided adhesive backing

This thermal conductive interface material is produced through a specialized process, utilizing silicone resin as the matrix and filled with thermally conductive fillers. Compared to other thermal interface materials (TIMs), it offers higher thermal conductivity and improved mechanical strength. The product features single-sided adhesive backing for easy handling and application. It is suitable for covering uneven or irregular device surfaces, effectively filling the gap between heat-generating components and heat sinks to achieve optimal heat dissipation. We deliver tailored packaging and labeling.

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1.5–12W Thermal Conductive Pad (Customizable)

This product is manufactured via advanced processes, with a silicone resin matrix loaded with thermally conductive fillers. It boasts high thermal conductivity, excellent mechanical strength, and ease of application, making it a best-selling thermal interface material on the market. Compared to other thermal interface materials, this product is better able to adapt to uneven or irregular device surfaces, enabling it to fully fill the gap between heat-generating components and heat sinks, thereby achieving high-performance heat dissipation. Customized solutions are available to meet specific customer needs and adapt to diverse application scenarios. Whether in the electronics, computer, or automotive industries, this product consistently delivers outstanding performance, ensuring stable equipment operation and extending equipment service life. We deliver tailored packaging and labeling.

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