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8W Fiberglass Thermal Conductive Pad

8W Fiberglass Thermal Conductive Pad

This thermal conductive interface material is produced through a specialized process, utilizing silicone resin as the matrix and filled with thermally conductive fillers. Compared to other thermal interface materials (TIMs), it offers higher thermal conductivity and improved mechanical strength. The product features single-sided adhesive backing for easy handling and application. It is suitable for covering uneven or irregular device surfaces, effectively filling the gap between heat-generating components and heat sinks to achieve optimal heat dissipation. We deliver tailored packaging and labeling.

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6W PI Film Backing Thermal Conductive Pad

6W PI Film Backing Thermal Conductive Pad

This thermal conductive interface material is produced through a specialized process, utilizing silicone resin as the matrix and filled with thermally conductive fillers. Compared to other thermal interface materials (TIMs), it offers higher thermal conductivity and improved mechanical strength. The product features single-sided adhesive backing for easy handling and application. It is suitable for covering uneven or irregular device surfaces, effectively filling the gap between heat-generating components and heat sinks to achieve optimal heat dissipation. We deliver tailored packaging and labeling.

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Material Technology

5W Fiberglass Thermal Conductive Pad Single-sided adhesive backing

5W Fiberglass Thermal Conductive Pad Single-sided adhesive backing

This thermal conductive interface material is produced through a specialized process, utilizing silicone resin as the matrix and filled with thermally conductive fillers. Compared to other thermal interface materials (TIMs), it offers higher thermal conductivity and improved mechanical strength. The product features single-sided adhesive backing for easy handling and application. It is suitable for covering uneven or irregular device surfaces, effectively filling the gap between heat-generating components and heat sinks to achieve optimal heat dissipation. We deliver tailored packaging and labeling.

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Material Technology

3W Thermal Grease/Thermal Paste (Customizable)

3W Thermal Grease/Thermal Paste (Customizable)

DTH0351 is a paste-type thermal interface material designed for use between high-power electronic components and heat sinks. Its excellent wettability enables it to rapidly fill micro-pores on the contact interface, significantly reducing interfacial thermal resistance.It can quickly and effectively lower the temperature of electronic components, thereby extending their service life and improving operational reliability. In addition to high thermal conductivity, the product exerts no stress during application and maintains high stability within the temperature range of -40℃ to 125℃, fully complying with the requirements of the electronics industry for paste-type thermal interface materials.

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Material Technology

Dingtai New Materials

China: Building 3, Huashen Wisdom Port, Hongmei Town, Dongguan City, Guangdong Province

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