Language

Application

Feature

• High thermal conductivity, easy to process, easy to repair;
• No leakage, and excellent adhesion after warming;
• Does not dry out and has excellent volatility stability;
• Multiple thickness options available, with a favorable phase-change temperature.

Parameter

• Storage environment: Temperature 5–35℃, humidity 0–65%.
• Shelf life: 12 months;
• Packaging specifications: Sheets (customizable).

Key factors for selecting thermally conductive phase-change materials

Selecting the right thermally conductive phase-change material requires a comprehensive consideration of several factors, much like answering a multiple-choice question:

• Although phase-change energy storage materials and phase-change shims both share the “phase-change” characteristic, their core missions and application logics are fundamentally different: the former is a macroscopic “thermal management strategist,” dedicated to the spatiotemporal transfer of energy and maintaining constant temperature; the latter is a microscopic “interface thermal conductivity engineer,” focused on optimizing the thermal conduction path between two solid contact surfaces.
• The core of phase-change energy-storage materials lies in their function as “thermal buffer batteries.” By absorbing or releasing large amounts of latent heat during their own phase transitions, these materials help stabilize temperature fluctuations and shift peak energy demand to off-peak periods, thereby effectively leveling out energy consumption. The key factors in selecting such materials include precisely matching the phase-change temperature with the target temperature-control range, achieving high latent heat of phase change to maximize energy-storage density, and ensuring excellent cycling stability for long-term durability. These materials find wide application in macroscopic systems that require “heat storage” or “temperature maintenance,” such as building energy conservation, industrial waste-heat recovery, and cold-chain thermal insulation.
• A phase-change gasket is essentially an intelligent thermal interface material whose mission is to replace traditional thermal greases or conventional gaskets, thereby addressing the thermal-conduction bottleneck at the interface between chips and heat sinks. At room temperature, it exists as a solid sheet that’s easy to handle. Once installed, as the chip heats up during operation and reaches its phase-change point (typically between 45°C and 60°C), the gasket softens and flows, perfectly filling microscopic gaps at the interface to achieve extremely low thermal contact resistance. Its irreplaceable value lies in combining the ease of installation typical of solids with the “liquid-like” filling capability of fluids—while completely overcoming the drawbacks of thermal greases, such as drying out and pumping issues, as well as the high thermal resistance inherent in conventional gaskets. As a result, it has become the ideal choice for high-end chip cooling applications, balancing both high performance and ultra-long-term reliability.
• In short, if you need to regulate the temperature of a space or system and manage the temporal distribution of thermal energy, you should choose phase-change thermal storage materials. If, on the other hand, you aim to optimize the thermal conductivity between two closely contacting solid surfaces (such as a chip and a heat sink), you should opt for phase-change thermal interface pads.