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4.5 W Thermal Conductive Phase Change Material ( Customizable)

4.5 W Thermal Conductive Phase Change Material ( Customizable)

DTM8822 Thermal Phase Change Pad is a thermally conductive phase change material, formulated with special silicone resin as the matrix, incorporated with phase change paraffin powder and metal oxides, and manufactured via a specialized production process. Upon reaching the phase change temperature, the material softens and demonstrates exceptional wettability, which effectively enhances the heat transfer efficiency between heat-generating components and heat-dissipating surfaces.

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3-5W Thermal Conductive Phase Change Material (Do Customizable)

3-5W Thermal Conductive Phase Change Material (Do Customizable)

Phase-change thermal pads are microscopic “interface thermal conductor,” specializing in optimizing heat transfer at the interface between chips and heat sinks. By leveraging phase-change fluid flow to fill microscopic gaps, these pads achieve extremely low thermal resistance and overcome the drying-out challenges associated with traditional thermal greases. They are specifically designed for chip cooling applications in consumer electronics, servers, and other devices that demand long-term stability. Phase-change energy-storage materials, on the other hand, are macroscopic “thermal management strategists.” Through state transitions, they enable spatiotemporal transfer of energy while maintaining constant temperature. Their core feature lies in their unique thermal management mechanism: by absorbing or releasing “latent heat of phase change” during state transitions—such as solid-to-liquid transformations—they achieve highly efficient energy regulation.We deliver tailored packaging and labeling.

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Dingtai New Materials

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